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M
Features
* High Peak Output Current - 1.5A * Wide Input Supply Voltage Operating Range: - 4.5V to 30V * High Capacitive Load Drive Capability: - 1000 pF in 25 nsec * Short Delay Times - <78 nsec Typ. * Low Supply Current: - With Logic `1' Input - 2.5 mA - With Logic `0' Input - 300 A * Low Output Impedance - 7 * Latch-Up Protected: Will Withstand >300 mA Reverse Current * ESD Protected - 4 kV
TC4431/TC4432
General Description
The TC4431/TC4432 are 30V CMOS buffer/drivers suitable for use in high-side driver applications. They will not latch-up under any conditions within their power and voltage ratings. They can accept, without damage or logic upset, up to 300 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 4 kV of electrostatic discharge. Undervoltage lockout circuitry forces the output to a `low' state when the input supply voltage drops below 7V. For operation at lower voltages, disable the lockout and start-up circuit by grounding pin 3 (LOCK DIS); for all other situations, pin 3 should be left floating. The under-voltage lockout and start-up circuit gives brownout protection when driving MOSFETS.
1.5A High-Speed 30V MOSFET Drivers
Applications
* Small Motor Drive * Power MOSFET Driver * Driving Bipolar Transistors
Package Types
8-Pin PDIP/SOIC/CERDIP
VDD 1 8 VDD IN 2 7 OUT TC4431 LOCK DIS 3 6 OUT GND 4 5 GND 2 7
Inverting
6
VDD 1 8 VDD IN 2 7 OUT TC4432 LOCK DIS 3 6 OUT GND 4 5 GND 2 7 6
Non Inverting
2003 Microchip Technology Inc.
DS21424C-page 1
TC4431/TC4432
Functional Block Diagram
8V DD 3 LOCK DIS 2 mA Inverting TC4431 7 OUT OUT 6 2 Input 4, 5 GND Non-Inverting TC4432 TC4431/TC4432 Inverting/Non Inverting Effective Input C = 10 pF UV LOCK
250 mV
DS21424C-page 2
2003 Microchip Technology Inc.
TC4431/TC4432
1.0 ELECTRICAL CHARACTERISTICS
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Supply Voltage ....................................................... 36V Input Voltage (Note 1)................... VDD + 0.3V to GND Package Power Dissipation (TA 70C) PDIP ............................................................ 730 mW CERDIP ....................................................... 800 mW SOIC............................................................ 470 mW Maximum Junction Temperature, TJ ................ +150C Storage Temperature Range.............. -65C to +150C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25C with 4.5V VDD 30V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Current (Note 1) Output High Output Voltage Low Output Voltage Output Resistance Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 2) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Start-up Threshold Drop-out Threshold Note 1: 2: 3: IS VS VDO -- -- -- 7 2.5 0.3 8.4 7.7 4 0.4 10 -- mA V V Note 3 VIN = 3V VIN = 0V tR tF tD1 tD2 -- -- -- -- 25 33 62 78 40 50 80 90 nsec Figure 4-1 nsec Figure 4-1 nsec Figure 4-1 nsec Figure 4-1 VOH VOL RO IPK IREV VDD - 1.0 -- -- -- -- -- VDD - 0.8 -- 7 3.0 1.5 0.3 -- 0.025 10 -- -- -- V V A A IOUT = 10 mA, VDD = 30V Source: VDD = 30V Sink: VDD = 30V Duty cycle 2%, t 300 sec IOUT = 100 mA VIH VIL IIN 2.4 -- -1 -- -- -- -- 0.8 1 V V A 0V VIN 12V Sym Min Typ Max Units Conditions
For inputs >12V, add a 1 k resistor in series with the input. See "Typical Characteristics" graph for input current. Switching times are ensured by design. For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating.
2003 Microchip Technology Inc.
DS21424C-page 3
TC4431/TC4432
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise noted, Over operating temperature range with 4.5V VDD 30V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Current (Note 1) Output High Output Voltage Low Output Voltage Output Resistance Switching Time (Note 2) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Start-up Threshold Drop-out Threshold Note 1: 2: 3: IS VS VDO -- -- -- 7 -- -- 8.4 7.7 6 0.7 10 -- mA V V Note 3 VIN = 3V VIN = 0V tR tF tD1 tD2 -- -- -- -- -- -- -- -- 60 70 100 110 nsec Figure 4-1 nsec Figure 4-1 nsec Figure 4-1 nsec Figure 4-1 VOH VOL RO VDD - 1.2 -- -- -- -- -- -- 0.025 12 V V IOUT = 10 mA, VDD = 30V IOUT = 100 mA VIH VIL IIN 2.4 -- -10 -- -- -- -- 0.8 10 V V A 0V VIN 12V Sym Min Typ Max Units Conditions
For inputs >12V, add a 1 k resistor in series with the input. See "Typical Characteristics" graph for input current. Switching times are ensured by design. For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 30V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (E) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-CERDIP JA JA JA -- -- -- 155 125 150 -- -- -- C/W C/W C/W TA TA TJ TA 0 -40 -- -65 -- -- -- -- +70 +85 +150 +150 C C C C Sym Min Typ Max Units Conditions
DS21424C-page 4
2003 Microchip Technology Inc.
TC4431/TC4432
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25C with 4.5V V DD 30V.
60 VDD = 12V 50 40 30 900 kHz 20 10 0 100 200 kHz 20 kHz 1000 CLOAD (pF) 10,000 600 kHz 2 MHz 125 100 75 50 25 0 3 6 9 12 15 18 VDD (V) 21 24 27 30 tRISE tFALL 150
CLOAD = 1000 pF TA = +25C
ISUPPLY (mA)
Time (nsec)
FIGURE 2-1: Capacitive Load.
50 45
Supply Current vs.
FIGURE 2-3:
Rise/Fall Time vs. VDD.
300 250 tD1 200 150
tD2
CLOAD = 1000 pF TA = +25C
INPUT CURRENT (mA)
40 35 30 25 20 15 10 5 0 3 6 9 12 15 18 21 24 INPUT VOLTAGE (VIN) 27 30 WITH 1 K RES. WITHOUT 1 K RES.
TIME (nsec)
100 50 0 3 6 9 12 15 18 VDD (V) 21 24 27 30
FIGURE 2-2: Voltage.
Input Current vs. Input
FIGURE 2-4:
tD1 and tD2 Delay vs. VDD.
2003 Microchip Technology Inc.
DS21424C-page 5
TC4431/TC4432
3.0 PIN DESCRIPTIONS
3.3 Lockout Disable (LOCK DIS)
The descriptions of the pins are listed in Table 3-1. The lockout pin enables/disables the undervoltage lock-out feature of the device. If undervoltage lockout is desired (output is not enabled until the bias voltage reaches 8.4V (typical) on the rising edge and is disabled when the bias voltage reaches 7.7V (typical) on the falling edge), the lockout pin should be left floating. If operation below 7V is desired, the lockout pin should be tied to ground.
TABLE 3-1:
Pin No. 1 2 3 4 5 6 7 8
PIN FUNCTION TABLE
Description Supply Input, 4.5V to 30V TTL/CMOS Compatible Input Input Pin, Enable/Disable for UV Lockout Ground Ground Drive Output, Pull Down Drive Output, Pull Up Supply Input, 4.5V to 30V VDD
IN
Symbol
LOCK DIS GND GND
3.4
Ground (GND)
OUT OUT VDD
The ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. Both ground pins should be used to ensure proper operation. The ground pins should be tied into a ground plane or have short traces to the bias supply source return.
3.1
Supply Input (VDD)
The V DD input is the bias supply input for the MOSFET driver and is rated for 4.5V to 30V with respect to the ground pins. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of this capacitor should be chosen based on the capacitive load that is being driven.
3.5
Drive Output (OUT)
3.2
Control Input (IN)
The TC4431/TC4432 devices have individual source and sink output pins. This feature can be used to adjust the rise and fall time independently by adding separate charge and discharge resistors external to the device. Pin 7 (source output) can source 3A peak currents into capacitive loads and pin 6 (sink output) can sink 1.5A peak currents from a capacitive load.
The MOSFET driver input is a TTL/CMOS compatible input with 250 mV of hysteresis between the high and low threshold voltages. If an input signal level of greater than 12V is applied to the device, a series current limiting resistor is recommended.
DS21424C-page 6
2003 Microchip Technology Inc.
TC4431/TC4432
4.0 APPLICATIONS INFORMATION
+5V Input VDD = 30V 4.7 F 1, 8 Input 2 7 Output 6 C L= 1000 pF +5V LOCK DIS 3 Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL 10 nsec 0V VDD Output 0V 10% 10% tD1 90% 90% tD2 10% 0.1 F 0V VDD Output 0V 10% 10% 10% tD1 90% tF tD2 tR 90% 90%
Inverting Driver
90%
tR
tF
Non-Inverting Driver FIGURE 4-1: Switching Time Test Circuit.
2003 Microchip Technology Inc.
DS21424C-page 7
TC4431/TC4432
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil) Example:
XXXXXXXX XXXXXNNN YYWW
TC4431 CPA256 0302
8-Lead SOIC (150 mil)
Example:
XXXXXXXX XXXXYYWW NNN
TC4431 COA0302 256
8-Lead CERDIP (300 mil)
Example:
XXXXXXXX XXXXXNNN YYWW
TC4431 EJA256 0302
Legend:
XX...X YY WW NNN
Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21424C-page 8
2003 Microchip Technology Inc.
TC4431/TC4432
8-Lead Plastic Dual In-line (P) - 300 mil (PDIP)
E1
D 2 n 1 E
A
A2
c
L A1
eB
B1 p B
Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB
MIN
INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10
MAX
MIN
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15
MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10
MAX
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018
2003 Microchip Technology Inc.
DS21424C-page 9
TC4431/TC4432
8-Lead Ceramic Dual In-line (JA) - 300 mil (CERDIP)
E1
2 n 1 D E A2 A
c eB A1 B1 B p
L
Number of Pins Pitch Top to Seating Plane Standoff Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing *Controlling Parameter JEDEC Equivalent: MS-030
Drawing No. C04-010
Units Dimension Limits n p A A1 E E1 D L c B1 B eB
MIN
.160 .020 .290 .230 .370 .125 .008 .045 .016 .320
INCHES* NOM 8 .100 .180 .030 .305 .265 .385 .163 .012 .055 .018 .360
MAX
MIN
.200 .040 .320 .300 .400 .200 .015 .065 .020 .400
MILLIMETERS NOM 8 2.54 4.06 4.57 0.51 0.77 7.37 7.75 5.84 6.73 9.40 9.78 3.18 4.13 0.20 0.29 1.14 1.40 0.41 0.46 8.13 9.15
MAX
5.08 1.02 8.13 7.62 10.16 5.08 0.38 1.65 0.51 10.16
DS21424C-page 10
2003 Microchip Technology Inc.
TC4431/TC4432
8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC)
E E1
p D 2 B n 1
h 45
c A
A2
L A1
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D h L c B
MIN
.053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0
INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12
MAX
MIN
.069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15
MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12
MAX
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057
2003 Microchip Technology Inc.
DS21424C-page 11
TC4431/TC4432
NOTES:
DS21424C-page 12
2003 Microchip Technology Inc.
TC4431/TC4432
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range
TC4431: TC4432:
/XX Package
Examples: a) b) TC4431COA: 1.5A MOSFET driver, SOIC package, 0C to +70C. TC4431EJA: 1.5A MOSFET driver, CERDIP package, -40C to +85C.
Device:
1.5A High-Speed 30V MOSFET Driver, Inverting 1.5A High-Speed 30V MOSFET Driver, Non Inverting 0C to +70C -40C to +85C
a) b)
Temperature Range:
C E
= =
TC4432CPA: 1.5A MOSFET driver, PDIP package, 0C to +70C. TC4432EPA: 1.5A MOSFET driver, PDIP package, -40C to +85C.
Package:
JA = Ceramic Dual In-line (300 mil Body), 8-lead * OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead * Offered in E-temp range only.
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2003 Microchip Technology Inc.
DS21424C-page 13
TC4431/TC4432
NOTES:
DS21424C-page 14
2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2003 Microchip Technology Inc.
DS21424C-page 15
DSTEMP
DS21424C-page 16
2003 Microchip Technology Inc.
M
WORLDWIDE SALES AND SERVICE
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05/30/03
DS21424C-page 17
2003 Microchip Technology Inc.

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